Thermally stable low dielectric norbornene polymers with improved solubility and adhesion property
作者： Kook Heon Char , Seung Jae Yang , Jin Kyu Lee , Joo Hyeon Park , Dong Woo Yoo
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摘要: The present invention provides norbornene-based copolymers for which one monomer is at least selected from a group consisting of norbornene and dicyclopentadiene, the other comonomers Formula 1 shown below: In 1, R , 2 are defined in this specification. insulating elements multi-chip packages antireflection films exposure process semiconductor fabrication using said copolymers. Norbornene-based according to have low dielectric constant as well high thermal stability excellent solubility various organic solvents.
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