Laser assisted polymer bonding technology for advanced MEMS packaging
作者： J. Zeng , C.H. Wang
DOI: 10.1109/ESTC.2008.4684528
关键词:
摘要: This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation MEMS and other microscale sensor devices. The rings were fabricated on capping substrates photosensitive BCB resin photolithography then bonded onto device to form microcavities packaging. A high-power fibre-coupled diode at wavelength 970 nm was used as heat source bonding/curing in conjunction with novel beam forming optics that allows selective illumination be joined. Defect free realised 10 seconds power order 50 W 1 kgf force. quality produced bond assessed optical inspection leak test it shown is good formed conventional hotplate based approach, but reducing time by factor ~100.
hw.ac.uk
sci-hub.se 参考文章(19)
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