摘要: The emerging multichip packaging technology offers significant advantages in miniaturization, electrical performance, thermal lower cost, and improved reliability. Newly available materials processes have stimulated applications ranging from low cost consumer electronics automotive modules to advanced aerospace supercomputers. Avionics share the same systems integration issues as other applications: optimum partitioning, seamless CAD/CIM tools, testability repairability strategies, cost-effective manufacturing, availability of vendor support technologies, reliable for long life environmental stresses. State-of-the-art avionics are detailed. Industry developments required enable wider utilization discussed. Evolutionary extensions into next generation technologies >
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