作者: Karim Arabi , Bozena Kaminska
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摘要: Built-in temperature sensors increase the system reliability by predicting eventual faults caused excessive chip temperatures. In this paper, simple and efficient built-in for on-line thermal monitoring of microelectronics structures are introduced. The proposed produce a signal oscillating at frequency proportional to structure therefore they compatible oscillation-test method. method is low-cost robust test mixed-signal integrated circuits based on transforming circuit under (CUT) an oscillator. This paper presents design detailed characteristics CMOS 1.2 µm technology parameters Mitel S.C.C. Extensive post-layout simulations show that oscillation very sensitive variations. require small power dissipation silicon area.