Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders
作者： A. Yakymovych , P. Švec , L. Orovcik , O. Bajana , H. Ipser
DOI: 10.1007/S11664-017-5834-9
关键词:
摘要: This study investigates the effect of minor additions Ni, Ni3Sn or Ni3Sn2 nanoparticles on microstructure and mechanical properties Cu/solder/Cu joints. The nanocomposite Sn-3.0Ag-0.5Cu (SAC305) solders with 0.5, 1.0 2.0 wt.% metallic were prepared through a paste mixing method. employed Ni Ni-Sn produced via chemical reduction as-solidified joints was studied by x-ray diffraction scanning electron microscopy. results showed that to SAC305 solder lead initially decrease in average thickness intermetallic compound layer interface between substrate, while further up did not induce any significant changes. In addition, shear strength microhardness tests performed investigate relationship investigated indicated an increase both these which most for using 0.5 wt.% nanoparticles.
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