Stress gradient due to incremental forming of bonded metallic laminates

摘要: ABSTRACTThe residual stress and associated gradient can affect the performance of a material/component during service. Sheet-metal in incremental sheet forming (ISF) due to missing back support may experience high across thickness. The current work is aimed at experimentally analyzing through-thickness Cu/steel bonded laminates after ISF deformation. It found that induces compressive gradient, which be way greater (about 18 times) than rolling process parent while bonding, specifically when deformation angle high. Further, tool imposes more (1–50% depending on conditions) its motion direction transverse (or stretching) direction. Moreover, un-strained laminated experiences higher (25%–68%) pre-strained/rolled endures. Regarding role technological parameters, angle, small tool, average step-siz...