Thermal contact resistance evaluation of a thermoelectric system by means of three I-V curves

摘要: Abstract To achieve a suitable performance in thermoelectric (TE) device it is important to minimize the thermal contact resistances between external surfaces and heat exchangers of system (heat source sink). Despite its relevance, there are not many methods available for evaluation resistance, existing ones typically employ complex setups. Here, we present new method determine resistance TE thermally contacted sink source. The based on performing three current-voltage (I-V) curves at different conditions under small temperature difference. First, an I-V curve with high voltage scan rate, which avoids variation initial difference, provides ohmic resistance. A second performed constant input power (or suspended) Finally, third difference allows obtaining Using this method, resistivity value 3.57 × 10−4 m2KW−1 was obtained commercial Bi-Te module using grease as interface material, good agreement reported values. highly advantageous, since neither involves setups nor requires measurement fluxes. Moreover, measures directly operating differences.