作者: Talysa R. Klein , Benjamin G. Lee , Manuel Schnabel , Emily L. Warren , Pauls Stradins
DOI: 10.1109/PVSC.2017.8366090
关键词:
摘要: Methods of making silicon based tandem cells include wafer bonding, depositing absorber layers on the surface, and mechanical stacking. Of these, mechanically stacking after growth retains individual cell quality during production, but typically requires a four-terminal device. We present transparent conductive adhesive (TCA) interlayer, designed for transparency in wavelengths that Si absorbs, conductivity out-of-plane between cells, strength, enabling two-terminal stacked tandems. The developed TCA material is polymer-particle blend common adhesives metal-coated flexible microspheres, capable bridging micro-scale gaps uneven/textured surfaces. At 10% microsphere coverage, experimental theoretical series resistance compatible with high-efficiency silicon.