作者: Tianyu Cai , Li Yuan , Guozheng Liang , Hong Wang , Aijuan Gu
DOI: 10.1016/J.MATCHEMPHYS.2019.05.090
关键词:
摘要: Abstract Achieving lower curing temperature and higher properties has been the significant target for developing heat-resistant thermosetting resins. Herein, a facile covalent approach built to fabricate functionalized graphene oxide (HBP@GO/MnF) through grafting hyperbranched polysiloxane (HBP) hybridizing metal–organic framework with Mn2+ (MnF), which proved have desirable abilities of simultaneously decreasing as well improving toughness stiffness while maintaining biggest advantage (low dielectric loss) high thermal resistance cyanate ester (BCy) resin. A comparative study demonstrates that activation from HBP endows HBP@GO/MnF good dispersion in BCy resin provides strong interfacial action between When loading is small 0.5 wt%, peak reduces 278 °C 313 °C BCy, meanwhile severally about 60%, 98%, 120% 93% increased flexural strength, modulus, impact strength fracture are achieved. In addition, all modified resins post-cured at 220 °C/4 h better mechanical heat than pure 240 °C 4 h. These outstanding performances prove promising filler fabricating new feature.