Method and apparatus for applying bonding adhesive
作者： Paul E. Crittenden , John D. Fickes , Pei-Chung Wang
DOI:
关键词:
摘要: A dispensing apparatus for adhesive includes an source and a member. The member is movably attached to the source. nozzle located on dispense onto component. heating element also heat Finally, roller apply pressure adhesive.
lens.org 参考文章(51)
Daniel G. Hullihen, John S. Berkes, Variable dwell fuser ,(1998)
Victor Tamosaitis, William F. Rush, Joseph M. Katz, Method for application of protective polymer coating ,(1999)
Masahiko Konno, Dispenser for applying solder ,(1992)
Robert L Goethe, Robert R Green, Paving crack sealer machine ,(1973)
Chris Coss, Dehydration of body hem flanges ,(2006)
Michael George, Damian Daykin, Christofer Ratcliffe, Apparatus for coating pipes ,(2008)
Joseph L. Pouliot, Bruce F. Field, Ultraviolet sanitation device ,(2004)
Rauno Smått, Leif Leidén, Sven Sjöberg, Method and apparatus for coating pipes and pipe sections ,(2009)
Hideaki Kuwabara, Fuminori Tateishi, Manufacturing apparatus of semiconductor device and pattern-forming method ,(2005)
Hiromu Ando, Yuzoh Inukai, Coating method and planographic printing plate ,(2004)