Substrate plating apparatus
作者： Atsushi Chono , Akihisa Hongo , Manabu Tsujimura , Norio Kimura , Kenichi Suzuki
DOI:
关键词:
摘要: A substrate plating apparatus forms an interconnection layer on region composed of a fine groove and/or hole defined in substrate. The includes unit for forming plated surface the including region, chemical mechanical polishing chemically mechanically to remove from leaving portion cleaning after is formed or polished, drying cleaned, and transfer transferring each first unit, unit. are combined into unitary arrangement.
lens.org 参考文章(46)
Brian Anthony Giles, Frederick John Schwab, Method and apparatus for cleaning semiconductor wafers ,(1987)
Yoshio Matsumura, Apparatus for and method of processing substrate ,(1996)
Masako Kodera, Harumitsu Saito, Shiro Mishima, Shoichi Kodama, Manabu Tsujimura, Riichiro Aoki, Yukio Imoto, 雅子 小寺, Atsushi Shigeta, 祥一 児玉, Hiromi Yajima, Yoshisuke Kono, 義介 河野, 志朗 三島, 利一郎 青木, 学 辻村, 比呂海 矢島, 厚 重田, Kazuaki Hiuga, 晴光 斎藤, 和明 日向, 幸男 井本, Semiconductor wafer polishing device ,(1994)
Akiyama Keiichi, IMAGE FORMING DEVICE ,(1991)
John E. Harris, Walter H. Rees, Automated method for the analysis and control of the electroless metal plating solution ,(1986)
Michael P. Hurley, Stephen J. Boezi, Method and system for controlling plating bath parameters ,(1993)
H. Vincent Reynolds, Plating cell with horizontal product load mechanism ,(1998)
Karl Buschor, Apparatus for the automatic coating of articles ,(1981)
Kazuhiro Taniguchi, Automatic wafer plating equipment ,(1997)
Osamu Miyazawa, Toyofusa Yoshimura, Tokio Isogai, Hitoshi Yokono, Haruo Suzuki, Akira Matsuo, Isamu Tanaka, Hitoshi Oka, Hiroshi Kikuchi, Process for regenerating chemical copper plating solution ,(1980)