Series interconnected optoelectronic device module assembly

摘要: Series interconnection of optoelectronic device modules is disclosed. Each module includes an active layer disposed between a bottom electrode and transparent conducting layer. An insulating the first backside top module. One or more vias are formed through layer, Sidewalls coated with material such that channel to The at least partially filled electrically conductive form plug makes electrical contact Portions second cut back expose portion attached carrier substrate. Electrical made exposed