Method of sealing an electronic device
作者： Stephen Yau Sang Cheng , Chung-Pui Chan , Chui-Ling Yip
DOI:
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摘要: A method of sealing an electronic device is disclosed, comprising providing assembly first and second substrates in opposed relationship, positioned between the substrates; positioning a glass rod against or on edge and/or substrate; heating softening to form hermetic seal hermetically sealed device.
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