作者: William J. Abeyta , Serapion Doaf , Kent A. Swanson
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摘要: A ganged saw blade assembly for dicing of wafers includes a plurality circular blades positioned along common central axis and erodible pitch spacers the between adjacent blades. The are eroded to desired diameter relative maintain exposure, e.g. by sawing into an abrasive material with assembly. thus permits use over longer periods notwithstanding erosion