Air-cavity module with enhanced device isolation
作者： Baker Scott , George Maxim , Julio C. Costa , Dirk Robert Walter Leipold
DOI:
关键词:
摘要: The present disclosure relates to an air-cavity module having a thinned semiconductor die and mold compound. includes back-end-of-line (BEOL) layer, epitaxial layer over the BEOL buried oxide (BOX) with discrete holes layer. air-cavity, first device section, second section. Herein, is in between section directly connection each hole BOX compound resides at least portion of within which are located. does not enter into through holes.
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