Mechanical bonding of surface conductive layers
作者： Robert B. Lomerson
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摘要: An electrically conductive path through an insulating plate (10) is produced by forcing sheets of material (13, 14) into contact a hole (11) in the (10). The are forced together with sufficient force to produce cold weld junction, which then plated metal (102). Dies for producing utilize metallic spheres (110), rods (188) or chemically etched projections (228). Shaped dies (268, 272) form crimped joint without weld, and offset (246, 250) raised junction (252) use as mount planar component. In manufacturing printed circuit board (160) die (158) same drill pattern used holes (160). A cause metalurgical bonding opposed conductors may also be applied explosive discharge. area created enlarged laser beam. Opposing foils on either side dielectric joined fusing
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