Study on a novel thermoset nanocomposite form DGEBA–cycloaliphatic diamine and metal nanoparticles

作者: Omid Zabihi , Mehran Aghaie , Karim Zare

DOI: 10.1007/S10973-011-2150-0

关键词:

摘要: … , the advanced isoconversional method is utilized to describe the curing reaction process. In the dynamic DSC analyses, the curing kinetics could be successfully described with the two-…

参考文章(43)
Emmanuel Delamarche, Matthias Geissler, James Vichiconti, William S. Graham, Paul A. Andry, John C. Flake, Peter M. Fryer, Ronald W. Nunes, Bruno Michel, Eugene J. O'Sullivan, Heinz Schmid, Heiko Wolf, Robert L. Wisnieff, Electroless Deposition of NiB on 15 Inch Glass Substrates for the Fabrication of Transistor Gates for Liquid Crystal Displays Langmuir. ,vol. 19, pp. 5923- 5935 ,(2003) , 10.1021/LA0341714
Qing Guo, Yan Huang, Yu-Ying Zhang, Li-Rong Zhu, Bao-Long Zhang, Curing behavior of epoxy resins with a series of novel curing agents containing 4,4′-biphenyl and varying methylene units Journal of Thermal Analysis and Calorimetry. ,vol. 102, pp. 915- 922 ,(2010) , 10.1007/S10973-010-0764-2
Melvin Avrami, Granulation, Phase Change, and Microstructure Kinetics of Phase Change. III Journal of Chemical Physics. ,vol. 9, pp. 177- 184 ,(1941) , 10.1063/1.1750872
J. F. Gerard, J. Galy, J. P. Pascault, S. Cukierman, J. L. Halary, VISCOELASTIC RESPONSE OF MODEL EPOXY NETWORKS IN THE GLASS TRANSITION REGION Polymer Engineering and Science. ,vol. 31, pp. 615- 621 ,(1991) , 10.1002/PEN.760310813
H. Stutz, J. Mertes, K. Neubecker, Kinetics of thermoset cure and polymerization in the glass transition region Journal of Polymer Science Part A. ,vol. 31, pp. 1879- 1886 ,(1993) , 10.1002/POLA.1993.080310726
Jintao Wan, Hong Fan, Bo-Geng Li, Cun-Jin Xu, Zhi-Yang Bu, Synthesis and nonisothermal reaction of a novel acrylonitrile-capped poly(propyleneimine) dendrimer with epoxy resin Journal of Thermal Analysis and Calorimetry. ,vol. 103, pp. 685- 692 ,(2011) , 10.1007/S10973-010-1006-3
I. Fraga, J. M. Hutchinson, S. Montserrat, Vitrification and devitrification during the non-isothermal cure of a thermoset Journal of Thermal Analysis and Calorimetry. ,vol. 99, pp. 925- 929 ,(2010) , 10.1007/S10973-009-0601-7
L. W. Crane, P. J. Dynes, D. H. Kaelble, Analysis of curing kinetics in polymer composites Journal of Polymer Science: Polymer Letters Edition. ,vol. 11, pp. 533- 540 ,(1973) , 10.1002/POL.1973.130110808
C.Y. Shigue, R.G.S. dosSantos, C.A. Baldan, E. Ruppert-Filho, Monitoring the epoxy curing by the dielectric thermal analysis method IEEE Transactions on Applied Superconductivity. ,vol. 14, pp. 1173- 1176 ,(2004) , 10.1109/TASC.2004.830477
A. Shabeer, A. Garg, S. Sundararaman, K. Chandrashekhara, V. Flanigan, S. Kapila, Dynamic Mechanical Characterization of a Soy Based Epoxy Resin System Journal of Applied Polymer Science. ,vol. 98, pp. 1772- 1780 ,(2005) , 10.1002/APP.22362