Method For Fabricating A Through Interconnect On A Semiconductor Substrate
作者： Chen Fu Chu
DOI:
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摘要: A method for fabricating a through interconnect on semiconductor substrate includes the steps of forming via first side part way substrate, an electrically insulating layer and in via, conductive at least partially lining contact thinning from second to via. The can also include step electrical with contact. be performed wafer form scale component. In addition, component used construct systems such as light emitting diode (LED) systems.
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