Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
作者： Younes Achkire , Dan A. Marohl , Timothy J. Franklin , Nathan D. Stein , Julia Svirchevski
DOI:
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摘要: In one aspect, a substrate processing apparatus is provided. The comprises mechanism for forming meniscus on surface of by moving the through fluid; an air knife positioned to apply shorten formed substrate; and drying vapor nozzle direct shortened knife. Numerous other aspects are
google.com.sv 参考文章(100)
Randolph E. Treur, John de Larios, Tom Anderson, John M. Boyd, Apparatus for oscillating a head and methods for implementing the same ,(2003)
Kyle K. Kirby, Warren M. Farnworth, Roy T. Lange, Daniel P. Cram, Salman Akram, Methods for placing substrates in contact with molten solder ,(2005)
Jose A. Berbel, Apparatus for drying objects with fluids ,(1999)
Hayato Iwamoto, Kazumi Asada, Teruomi Minami, Apparatus and method for drying semiconductor substrate ,(1999)
Hitoshi Tsuboi, Noribumi Koitabashi, Method for driving a recording head having a plurality of heaters arranged in each nozzle ,(1997)
Shigenori Tawa, Satoshi Kume, Hiroshi Katayama, Michio Ueda, Sterilizing liquid remover ,(2001)
Barrett Comiskey, Robert Feeney, Jonathan Albert, Ian Morrison, Paul Drzaic, Andrew Loxley, Libing Zhang, Joseph Jacobson, Retroreflective electrophoretic displaya and materials for making the same ,(2001)
Shafiq N. Fazel, Eric H. Klingenberg, David D. Miller, Jared Bender, Lan Cao, Electro-optic display and materials for use therein ,(2007)
Henry J. Bubley, UV curing apparatus ,(1985)
James J. Dolan, Continuous silver float casting of steel sheet or plate ,(1993)