作者: Sung-Hoon Choa , Young-Tack Hong , Jong-seok Kim , In-Sang Song
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摘要: A method of manufacturing a film bulk acoustic resonator and the manufactured thereby. The includes laminating sacrificial layer on semiconductor substrate, removing predetermined area from to realize electric contact between signal line substrate lower electrode, forming electrode by depositing metal for layer, patterning based shape piezoelectric material an upper wherein at least one deposition pressure power is controlled generate upward stress when electrode.