Hybrid bonding with air-gap structure

作者: Szu-Ying Chen , Dun-Nian Yaung

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摘要: A package component includes a surface dielectric layer having first planar surface, and metal pad in the layer. The diffusion barrier that sidewall portions, metallic material encircled by portions of has second level with surface. An air gap extends from into material. edge is aligned to an

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