Tz-Yi Liu, Tian Hong Yan, R. Scheuerlein, Yingchang Chen, J. K. Lee, G. Balakrishnan, G. Yee, H. Zhang, A. Yap, J. Ouyang, T. Sasaki, S. Addepalli, Ali Al-Shamma, Chin-Yu Chen, M. Gupta, G. Hilton, S. Joshi, A. Kathuria, V. Lai, D. Masiwal, M. Matsumoto, A. Nigam, A. Pai, J. Pakhale, Chang Hua Siau, Xiaoxia Wu, R. Yin, Liping Peng, Jang Yong Kang, S. Huynh, Huijuan Wang, N. Nagel, Y. Tanaka, M. Higashitani, T. Minvielle, C. Gorla, T. Tsukamoto, T. Yamaguchi, M. Okajima, T. Okamura, S. Takase, T. Hara, H. Inoue, L. Fasoli, M. Mofidi, R. Shrivastava, K. Quader,
A 130.7mm 2 2-layer 32Gb ReRAM memory device in 24nm technology international solid-state circuits conference. pp. 210- 211 ,(2013) ,
10.1109/ISSCC.2013.6487703