作者: Nevin Altunyurt , Madhavan Swaminathan , Ralf Rieske , Venkatesh Sundaram
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摘要: Recent developments in liquid crystalline polymer (LCP)-based procesing technology have shown that highly-integrated, fully-packaged RF front-end modules with high performance can be designed by using the system-onpackage (SOP) approach. However, direct integration of a large antenna element to small module package still remains an isue. This paper presents novel conformal structure which results compact and for 5GHz WLAN/WiMAX applications. The is printed on flexible LCP layer, protruding from rigid multilayer organic substrate. efects shielding metal case, protects asociated circuitry near fields antenna, are also considered during design proces. substrate bent folded over resulting tight module. details fabrication proposed structure, as well simulation measurement data presented this paper.