The properties of AlN-filled epoxy molding compounds by the effects of filler size distribution

摘要: AlN filler was compared with crystalline silica as a for advanced epoxy molding compounds. Properties such the thermal conductivity, dielectric constant, CTE, flexural strength, elastic modullus and water absorption ratio of water-resistant grade AlN-filled compounds according to contents or size distribution were evaluated. A spiral flow test also carried out measure change in viscosity improved fluidity. The properties EMC that is filled 70 vol.% 12 micron silica-filled EMC. Thermal conductivity by 2.2 times, constant reduced less than one-half, strength improved, CTE reduced. binary mixture an (65 vol.%) showed fluidity, resistance single-size maximum improvement obtained when fraction small particles 0.2–0.3. decreased increasing volume AlN.