Method and system for establishing a common reference point on a semiconductor wafer inspected by two or more scanning mechanisms

摘要: A method and system for establishing a common reference point on semiconductor wafer inspected by two or more scanning mechanisms. The includes plurality of dies identical size, each die being generally rectangularly shaped having four corners. Adjacent are separated street, the sum width street equaling period. with first mechanism to establish coordinate wafer. determines be center which is assigned value relative system. location in calculated as corner within half period from value, second then scanned establishes located can