作者: C. Jung-Kubiak , J. Gill , T. Reck , C. Lee , J. Siles
关键词:
摘要: Silicon micromachining technology is naturally suited for making THz components, where precision and accuracy are essentials. We report here the development of robust techniques to enable novel active passive components in submillimeter-wave region. These features will large format heterodyne arrays 3-D integration region, fabricating circuits structures becomes difficult with conventional machining.