Evolution of the Thermal Conductivity of Sintered Silver Joints with their Porosity Predicted by the Finite Element Analysis of Real 3D Microstructures
作者： L. Signor , P. Kumar , B. Tressou , C. Nadot-Martin , José Miranda-Ordonez
DOI: 10.1007/S11664-018-6253-2
关键词:
摘要: Silver paste sintering is a very promising technology for chip bonding in future power electronics modules owing to its high melting temperature and the good electrical thermal properties among other classic solder alloys. However, sintered form, these joints contain nanometric/submicrometric pores that affect their performance. The present study gives insight into relationship between material conductivity real three-dimensional porous structure using finite element modelling. It shown over certain pore fraction threshold (∼ 13%), morphology has non-negligible influence on conductivity. Results are also compared predictions obtained by analytical models available literature.
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