Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

摘要: Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice but is also limited by defects with a low yield. Here, we introduce wafer-recyclable, environment-friendly transfer process that enables wafer-scale separation high-performance in defect-free manner multiple reuses wafer. The interfacial delamination enabled through controllable cracking phenomenon water environment at room temperature. physically liberated can be then pasted onto arbitrary places interest, thereby endowing particular surface desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal underlying mechanics mechanism guide manufacturability for terms scalability, controllability, reproducibility.