Package-on-Package Structure with Through Molding Via
作者： Kuo-Chuan Liu , Fu-Jen Li , Po-Yao Lin , Ming-Chih Yew
DOI:
关键词:
摘要: Disclosed herein is a device comprising first package having side with plurality of connectors disposed thereon and second mounted on the by connectors. A molding compound between package. stress relief structures (SRSs) are in compound, SRSs each cavity free metal spaced apart from
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