Heat spreader with mechanically secured heat coupling element
作者： Konrad Pfaffinger
DOI:
关键词:
摘要: A heat spreader for dissipating generated by at least one heat-generating power semiconductor device. Such a comprises base plate (11) which is connectable in heat-conducting manner to the device (2), and coupling element (4) connected conducting (2) on hand other elastic layer (5). The holding mechanically fixing relative plane defined (11).
lens.org 参考文章(28)
Chen Shih-Tsung, Cooling device for an integrated circuit ,(2003)
Girish Upadhya, Thomas W. Kenny, Mark Munch, Kenneth Goodson, Peng Zhou, Removeable heat spreader support mechanism and method of manufacturing thereof ,(2004)
Gregory C. Franke, Donald J. Hall, Jeffrey A. Lambert, Easily removed heatsink clip ,(2003)
Kuo-Len Lin, Ken Hsu, Chen-Hsiang Lin, Chih-Hung Cheng, Cooling rack structure of thermoelectric cooling type ,(2010)
Kamal K. Sikka, Raschid J. Bezama, Hilton T. Toy, Govindarajan Natarajan, Microjet module assembly ,(2005)
Zhihai Zack Yu, Jeong H. Kim, Tommy C. Lee, Circuit board heat exchanger carrier system and method ,(2007)
Nguyen T. Nguyen, Susheela Narasimhan, Mohammad Reza Danesh Kadivar, Saeed Sayed, Heatsink attachment mechanism ,(2006)
Jeffrey Thomas Coffin, Jeffrey Allen Zitz, Frank Louis Pompeo, Alain A. Caron, Method for direct attachment of a chip to a cooling member ,(1999)
Ajit Sathe, Ravi Prasher, Eric Distefano, Kristopher Frutschy, Direct heatpipe attachment to die using center point loading ,(2001)
Jui-Chan Fan, Frank Wang, Heatsink device of video graphics array and chipset ,(2005)