Packaging of semiconductor integrated circuits

摘要: To package large scale semiconductor wafers (101) a packaging device (103) is provided which engages the e.g. by supporting members (105A,105B) and hence supports in spaced-apart stack. Preferably, include means for making electrical contact between (101). The may be form of pillar extending through holes (102) Alternatively (Fig. 1D), divided into sections are interposed adjacent or 2A) have plurality pillars (201) engage edges (203). Thus can stacked, made to devices on