Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics

摘要: The eutectic coarsening kinetics for 60Sn40Pb solder joints annealed at 50°C to 150° C was determined be of the form $$\bar D^n - \bar D_o^n = K_o \exp ( Q/RT)t$$ where \(\bar D\) is mean linear intercept phase size, D_o \approx 1.0\) μm as-reflowed n=4.1±0.15, Q=39.8±0.8 kJ/mole, Ko≈1×10−23−4.5×10−23 m4/s, and t time. magnitude size exponent, n, parameters, Ko Q, are in accord with models by Senkov Myshlyaev Ardell controlled grain boundary or interfacial solute diffusion. shape factor did not have a significant influence on kinetics.