Kinetic study of the effect of catalysts on the curing of biphenyl epoxy resin

作者: Seung Han , Whan Gun Kim , Ho Gyu Yoon , Tak Jin Moon

DOI: 10.1002/(SICI)1097-4628(19980516)68:7<1125::AID-APP10>3.0.CO;2-X

关键词:

摘要: The investigation of cure kinetics biphenyl epoxy (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl)dicyclopentadiene type phenolic resin system with different kinds catalysts was performed by a differential scanning calorimeter using an isothermal approach. All kinetic parameters the curing reaction including order, activation energy, and rate constant were calculated reported. results indicate that formulations triphenylphosphine (TPP), 1-benzyl-2-methylimidazole (1B2MI), tris(4-methoxyphenyl)phosphine (TPAP) as catalyst proceeds through nth-order mechanism, whereas thatof diazabicycloundecene (DBU) tetraphenyl phosphonium borate (TPP–TPB) autocatalytic mechanism. To describe in latter stage, we have used semiempirical relationship proposed Chern Poehlein. By combining model or auto-catalytic diffusion factor, it is possible to predict each catalytic over whole range conversion. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1125–1137,

参考文章(0)