3D Integrated Architectures for Microelectronic Two-Phase Flow Cooling Applications
作者： Yassir Madhour
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摘要: Keywords: electronic packaging ; thermal management 3D integration chip stacking solder bonding microscale flow boiling refrigerants These Ecole polytechnique federale de Lausanne EPFL, n° 6323 (2014)Programme doctoral EnergieFaculte des sciences et techniques l'ingenieurInstitut genie mecaniqueLaboratoire transfert chaleur masseJury: Prof. J.A. Schiffmann (president) J.R. Thome, Dr B. Michel (directeurs) D. Atienza Alonso, G. P. Celata, Wunderle (rapporteurs) Public defense: 2014-9-4 Reference doi:10.5075/epfl-thesis-6323Print copy in library catalog Record created on 2014-08-25, modified 2017-05-10
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