Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates
作者： Kelly Malone , Habib Hichri
DOI:
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摘要: A metal seed composition useful in seeding a diffusion barrier or conductive layer on semiconductor dielectric substrate, the comprising: nanoscopic component that includes as metal; an adhesive for attaching said substrate; and linker links with component. Semiconductor substrates coated compositions, well methods depositing are also described.
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