Solder-bump attached optical interconnect structure utilizing holographic elements and method of making same

摘要: An optical interconnect structure allows the transfer of data within a single integrated circuit as well interconnection multiple circuits. Opto-electronic transmitters and receivers which are fabricated under optimized conditions coupled to planar waveguides. The waveguides incorporate holographic elements direct emissions from opto-electronic into waveguide. Other incorporated diffract these out waveguide toward receivers. entire is tested separately circuits be interconnected. then by means controlled collapse chip connection, or solder bump, technology.