Service temperature connector and packaging structure of semiconductor device employing the same

摘要: The present invention discloses a connector comprising: an insulating substrate having plurality of through-holes and desired first circuit pattern formed on the substrate; female contactors each being fixed around edge through-hole opening, which extends inwardly through-hole, said electrically connected to pattern; male contactor comprising second thereon pins pattern, located in position corresponding openings contactors, wherein are made thin film shape memory alloy is given, before inserting pins, such that returned close opening when subjected temperature above martensitic transition temperature.