Conductive material patterning methods
作者： Alan R. Reinberg , Joseph E. Geusic
DOI:
关键词:
摘要: A patterning method includes providing a first material (e.g., copper) and transforming at least surface region of the to second copper oxide). One or more portions oxide) are converted one while remain. remaining removed selectively relative copper). Further, thickness may be increased. Yet further, diffusion barrier layer used for certain applications.
google.de 参考文章(38)
Geraldine C. Schwartz, Paul M. Schaible, Dry etching of copper patterns ,(1980)
Hideshi Miyajima, Jun-ichi Wada, Haruo Okano, Mie Matsuo, Kyoichi Suguro, Nobuo Hayasaka, Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide ,(1993)
Osamu Okada, Tomoaki Koide, Ko Sang Tae, Atsushi Sekiguchi, Akiko Kobayashi, Method of cleaning metallic films built up within thin film deposition apparatus ,(1998)
Jia Zhen Zheng, Lap Chan, Method of manufacturing copper interconnect with top barrier layer ,(1996)
Joseph E. Geusic, Kie Y. Ahn, Multilevel copper interconnects for ultra large scale integration ,(2002)
James L Fry, Rita Dr Klein, Stefan Dr Uhlenbrock, Electroless plating of a metal layer on an activated substrate ,(1997)
Fenton Read Mcfeely, Steven Paul Kowalczyk, Paul Fredrich Seidler, Mark Monroe Banaszak Holl, Selective, low-temperature chemical vapor deposition of gold ,(1993)
Mordechai Brestel, Method of printing an image on a substrate particularly useful for producing printed circuit boards ,(1992)
Alan R. Reinberg, Joseph E. Geusic, Removal of copper oxides from integrated interconnects ,(2001)
Valery Dubin, Self-encapsulated copper metallization ,(1998)