Transient liquid phase bonding of titanium to aluminium nitride
作者： O. Dezellus , J. Andrieux , F. Bosselet , M. Sacerdote-Peronnet , T. Baffie
DOI: 10.1016/J.MSEA.2007.10.104
关键词:
摘要: Titanium has been successfully joined to aluminium nitride AlN at a temperature as low as 795° C, using Ag–Cu Cusil® commercial braze alloy. While reactive wetting and spreading …
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hal.science 参考文章(22)
Mel M. Schwartz, Brazing: For the engineering technologist ,(1994)
Béatrice Drevet, Michael G. Nicholas, Nicolas Eustathopoulos, Wettability at high temperatures ,(1999)
Raymundo Arróyave, Thermodynamics and kinetics of ceramic/metal interfacial interactions Massachusetts Institute of Technology. ,(2004)
M. W. Chase, NIST-JANAF thermochemical tables Published by the American Chemical Society, and the American Institute of Physics for the National Institute of Standards and Technology. ,(1998)
H. Y. Chan, R. K. Shiue, Study of brazing Ti-6Al-4V and TZM alloy using pure silver Journal of Materials Science Letters. ,vol. 22, pp. 1659- 1663 ,(2003) , 10.1023/B:JMSL.0000004642.79837.D1
Y. Iino, Partial transient liquid-phase metals layer technique of ceramic-metal bonding Journal of Materials Science Letters. ,vol. 10, pp. 104- 106 ,(1991) , 10.1007/BF00721922
G Rosazza Prin, T Baffie, M Jeymond, N Eustathopoulos, Contact angles and spreading kinetics of Al and Al–Cu alloys on sintered AlN Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 298, pp. 34- 43 ,(2001) , 10.1016/S0921-5093(00)01317-4
N.Yu Taranets, H Jones, Wettability of aluminium nitride based ceramics of different porosity by two active silver based brazing alloys Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 379, pp. 251- 257 ,(2004) , 10.1016/J.MSEA.2004.02.021
W.F. Gale, D.A. Butts, Transient liquid phase bonding Science and Technology of Welding and Joining. ,vol. 9, pp. 283- 300 ,(2004) , 10.1179/136217104225021724
Antoni P Tomsia, Ronald E Loehman, None, Reactions and Microstructure at Selected Ceramic/Metal Interfaces Materials and Manufacturing Processes. ,vol. 9, pp. 547- 561 ,(1994) , 10.1080/10426919408934924