Interaction of Active MMIC with Package/Housing
作者： Deepak Ghodgaonkar , Sanjeev Gupta , Ashish Sarvaiya , Dhirubhai Ambani
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摘要: This paper presents enclosure effect comprehensive by 3D electromagnetic modeling, simulation and measurement of active MMIC with package/housing. When put inside a test box or package cavity, shows significant deviation from it RF On Wafer (RFOW) data. Cavity resonance‟s adverse effects were analyzed eigen mode solver using CST Microwave Studio RFOW in data was matched simulating package/house the best suited absorbers.
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