Method of fabricating a high-layer-count backplane

摘要: The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, economical backplane for routers like that require large number signaling paths across at speeds 2.5 Gbps or greater, as well distribution significant amounts power to router components. allow relatively thick (e.g., three- four-ounce copper) planes be combined with numbers high-speed layers in common backplane. Using traditional techniques, such would not possible because required thickness layers. embodiments use novel layer arrangements, material selection, processing panel produce desired low-noise high-power single mechanically stable board.