作者: Johann Greschner , Wolfgang D. Pohl , Urs T. Duerig , James K. Gimzewski , Olaf Wolter
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摘要: ABSTRACT The micromechanical sensor head is designed to measure forces down 10-13 N. It comprises a common base from which cantilever beam and member extend in parallel. carries sharply pointed tip of hard material, dielectric or not, for interaction with the surface sample be investigated. Bulges forming tunneling junction protrude facing surfaces said beams, gap between bulges being adjustable by means electrostatic generated potential (Vd) applied pair electrodes respectively coated onto parallel beams. consists one single piece semiconductor such as silicon gallium arsenide (or any other compounds thereof) fabricated dimensions required application conventional chip manufacturing techniques.