作者: Kihyon Hong , Dong Heon Choo , Han Ju Lee , Jae Yong Park , Jong-Lam Lee
DOI: 10.1016/J.ORGEL.2020.105936
关键词:
摘要: Improving device deformability under mechanical stress is an essential requirement for the realization of next-generation wearable electronic applications. Herein, we report a new …