The measurement of thermal conductivities using the photothermal deflection method for thin films with varying thickness

作者: H. J. Kim , J. H. Kim , P. S. Jeon , J. Yoo

DOI: 10.1007/S12206-009-0701-0

关键词:

摘要: This study considers non-contact methods that obviate the causes of measurement error, such as thermal contact resistance and unnecessary destruction samples. Among methods, photothermal deflection method has been adopted developed to measure conductivities thin-film materials. To apply for thin films, bi-layered materials are manufactured by depositing film on Corning 7740 glass plates. The also investigates optimal modulation frequency, related diffusion length sample, measuring films.. Aluminum, TiO2, Si3N4 films with micro/nanometer thickness were selected objects measurement; these experimentally measured. Samples ranging from 1 µm 200 nm prepared variations in thickness. It was observed conductivity submicroscale decreased reduced.

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