Electron work function: A parameter sensitive to the adhesion behavior of crystallographic surfaces
作者： D. Y. Li , W. Li
DOI: 10.1063/1.1428766
关键词:
摘要: The adhesive force (AF) and the electron work function (EWF) of different crystallographic planes Cu were determined, with aim exploring potential application Kelvin method in characterizing adhesion solid surfaces especially those nano/microdevices. It was demonstrated that there a close correlation between EWF AF, both parameters dependent on surface atomic arrangement. This study indicates is parameter could be used to characterize behavior surface.
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