作者: Monroe Waymer , Jennifer Hammond , John J. Ashman
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摘要: A method and apparatus for manufacturing an electrical connection unit connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the fitted between, soldered boards complete a circuit. The of includes providing first insulative base with one or more contacts contact groups extending side towards second base. Solder portions balls reflowed at their termination points. An provide positioning device means on top adjacent base, so that are placed within cavities device, alignment apertures heated reflow fuse termination, thereby constructing array.