Integrated circuit package including floating package stiffener

摘要: Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more circuits (ICs); a metallic structure that encircles the ICs being in contact with ICs, wherein is electrical ground; conductive epoxy layer disposed below structure, reduce electromagnetic field induced by response presence of wireless signal operates at approximately resonant frequency associated structure.