Improving mechanical and thermal reliability in varying form factors
作者： Shawna M. Liff , Sasha N. Oster , Veronica A Strong
DOI:
关键词:
摘要: A system for packaging integrated circuits includes an circuit having one or more terminals. The also a substrate further electrically conductive adhesive in communication with the terminals and establishes electrical connection between each of are enclosed dielectric. second substrate, wherein couples together.
lens.org 参考文章(16)
Takeaki Kawashima, Anisotropic conductive film and method of making conductive connection ,(2014)
Yoshiharu Sanagawa, Takamasa Sakai, Mitsuhiko Ueda, Shintarou Hayashi, Mounting structure of chip and module using the same ,(2009)
Mark M. Konarski, Rebecca Tishkoff, Erin K. Yaeger, J. Paul Krug, Lawrence N. Crane, Afranio Torres-Filho, Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith ,(2001)
Nachiket R. Raravikar, Yonghao Xiu, Yiqun Bai, Nisha Ananthakrishnan, Epoxy-amine underfill materials for semiconductor packages ,(2013)
Koji Watanabe, Tatsuo Suzuki, Toshio Enami, Yoshiyuki Takebe, Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body ,(2003)
Kyung-Wook Paik, Seung Ho Kim, Kiwon Lee, Anisotropic conductive adhesive for ultrasonic wave adhesion, and electronic parts connection method using same ,(2012)
Yoichi Hiruta, Kazuhide Doi, Takashi Okada, Naohiko Hirano, Masayuki Miura, Flip-chip semiconductor devices having two encapsulants ,(1995)
Yi He, Brian E Moreira, Alan Overson, Stacy H Nakamura, Christine Bider, John F Briscoe, Thermal characterization of an epoxy-based underfill material for flip chip packaging Thermochimica Acta. ,vol. 357, pp. 1- 8 ,(2000) , 10.1016/S0040-6031(00)00357-9
Sungwook Moon, H.H. Sigmarsson, Yilei Huang, T. Bruemmer, S.K. Khanna, W.J. Chappell, Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications IEEE Transactions on Microwave Theory and Techniques. ,vol. 56, pp. 2942- 2949 ,(2008) , 10.1109/TMTT.2008.2007309
Hirokazu Honda, Warp-suppressed semiconductor device ,(2010)