Epoxy resin composition for encapsulating semiconductor
作者： Shigeaki Yagi , Yoshihiro Nakata , Yukio Takigawa , Norio Sawatari
DOI:
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摘要: An epoxy resin composition for encapsulating semiconductors containing 5 to 50 parts by weight of a silicone-based flexibility imparting agent, 100 an at least two groups in one molecule thereof, 150 curing including phenolic resin, and 200 1,000 inorganic filler.
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