Wafer prober having sub-micron alignment accuracy

摘要: A wafer prober for testing uncut die of a semiconductor has an alignment accuracy in the X-Y plane within sub-micron range. The wafer, held by chuck, is positioned using pair linear servo motors each driven drive unit providing control, monitoring and diagnostic functions. Positional information obtained from encoders, one along axis. also resolvers, vertical axis other rotational position about Ways runner blocks are used to provide substantial downforce capability high speed translational movement. In addition, present invention uses general purpose computer on-board controller card interfacing with drives via fiber optic coupler. Wafers automatically loaded onto chuck juke box-type loader capable handling sizes between four (4) twelve (12) inches diameter. Connectivity network off-side or local trouble-shooting programming can be provided addition pager form alert event detected failure-mode.